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US Patent Issued to Tokyo Electron on April 7 for "Fabricating three-dimensional semiconductor structures" (New York Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,747, issued on April 7, was assigned to Tokyo Electron Ltd. (Tokyo). "Fabricating three-dimensional semiconductor structures" was invented ... Read More


US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on April 7 for "Three-dimensional memory devices and methods for forming the same" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,748, issued on April 7, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China). "Three-dimensional memory devices and methods ... Read More


US Patent Issued to Sandisk Technologies on April 7 for "Memory device including composite metal oxide semiconductor channels and methods for forming the same" (California Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,749, issued on April 7, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Memory device including composite metal oxide semico... Read More


US Patent Issued to SK hynix on April 7 for "Manufacturing method of semiconductor device" (South Korean Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,750, issued on April 7, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Manufacturing method of semiconductor device" was invented... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Semiconductor devices and data storage systems including the same" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,751, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor devices and data storage syste... Read More


US Patent Issued to Sandisk Technologies on April 7 for "Method of making a three-dimensional memory device using composite hard masks for formation of deep via openings" (California Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,752, issued on April 7, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Method of making a three-dimensional memory device u... Read More


US Patent Issued to SK hynix on April 7 for "Vertical semiconductor device and method for fabricating the same" (South Korean Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,753, issued on April 7, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Vertical semiconductor device and method for fabricating t... Read More


US Patent Issued to SK hynix on April 7 for "Electronic device having stacked structures and method for manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,754, issued on April 7, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Electronic device having stacked structures and method f... Read More


US Patent Issued to Zhuhai Chuangfeixin Technology on April 7 for "Memory storage device and method of manufacturing the same" (California Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,755, issued on April 7, was assigned to Zhuhai Chuangfeixin Technology Co. Ltd. (Zhuhai, China). "Memory storage device and method of manuf... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Phase change material (PCM) switch having low heater resistance" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,756, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Phase change material (PCM) switch ... Read More